Copper
ALDRICH/266744 - foil, thickness 1.0 mm, 99.999% trace metals basis
CAS Number: 7440-50-8
Empirical Formula (Hill Notation): Cu
Molecular Weight: 63.55
EC Number: 231-159-6
MDL Number: MFCD00010965
Linear Formula: Cu
Product Type: Chemical
| application(s) | battery manufacturing |
| assay | 99.999% trace metals basis |
| bp | 2567 °C (lit.) |
| density | 8.94 g/mL at 25 °C (lit.) |
| form | foil |
| InChI | 1S/Cu |
| InChI key | RYGMFSIKBFXOCR-UHFFFAOYSA |
| mp | 1083.4 °C (lit.) |
| Quality Level | 100  |
| resistivity | 1.673 μΩ-cm, 20°C |
| SMILES string | [Cu] |
| thickness | 1.0 mm |
| Application: | A corrosion resistant graphene reinforced composite coating was deposited on 1.0mm thick copper foil by electrophoretic deposition. |
| General description: | Copper exhibits excellent thermal and electrical conductivities along with high malleability. |
| Packaging: | 1 ea in rigid mailer |
| Packaging: | 11 g in rigid mailer |
| Preparation Note: | 25×50 mm (approximately 11 g) |
| Risk Statements | 53 |
| RIDADR | UN 3077 9 / PGIII |
| WGK Germany | WGK 2 |
| Flash Point(F) | Not applicable |
| Flash Point(C) | Not applicable |
| Purity | 99.999% trace metals basis |
| bp | 2567 °C (lit.) |
| mp | 1083.4 °C (lit.) |
| Density | 8.94 g/mL at 25 °C (lit.) |
| UNSPSC | 12141711 |